The 2024 3D InCites Yearbook

CONTRIBUTING AUTHORS Tom Bauer, author of Fostering Innovation from Within, serves as vice president of global human resources for Onto Innovation. Tom began his Onto career in 2021, and in his current role, he is responsible for leading Onto’s talent strategy the Department of Defense for several years. He began his career in microelectronics at Kyocera, worked for 6½ years at StratEdge, and most recently, was director of sales and marketing at Quik-Pak before returning to StratEdge.

Rene Dubois, the author of Bridging the Path from University to Industry, has had a lengthy career in the semiconductor industry, with experience in wet processing, rapid thermal processing and dry etch. His roles have ranged from technical and

Paul Lindner, author of EV Group: More than 40 Years of Growth Fueled by 3D/Heterogeneous Integration is EV Group's executive technology director. He heads the R&D, product and project management, quality management, business development,

field application support to global account management. Rene further honed his account management skills in the industrial market before returning in early 2023 to his career passion for semiconductor equipment at ClassOne Technology.

and process technology departments. Lindner also leads customer orientation throughout all steps of product development, innovation, and implementation in a production environment. He joined the company in 1988 as a mechanical design engineer and has since pioneered various semiconductor and MEMS processing systems, which have set industry standards. Before he was appointed executive technology director, Lindner established a product management department at EV Group. During that time, he was involved in marketing, sales, manufacturing, and on-site process support.

Mark Berry, author of The Year in Test, is an independent consultant in test strategies, operations, and business development. Past roles included fab-wide photo/etch, device engineering, and product/test ops across all chips in early-generation

including global talent acquisition, talent management, total rewards strategy, process, and systems. Talent management initiatives led by Tom have resulted in a 40% reduction in attrition over two years through a transparent alignment of organization goals and employee success. Additionally, he built a talent acquisition approach that supported the largest single-year headcount growth in the history of Onto. Tom holds a Bachelor of Science degree in interdisciplinary engineering from Clarkson University and brings over 25 years of experience to the organization. co-founder and President, of Mosaic Microsystems. He brings experience in the semiconductor industry from the perspective of private industry, academia, and government. Before Mosaic, Paul founded CEIS Products, a capital equipment company that reached $100 million and revenue and was taken public. Paul is also the Executive Director of the Center for Emerging and Innovative Sciences at the University of Rochester. CEIS is funded by New York State to promote economic development through industry- university collaboration and technology transfer. These three experiences give Paul an understanding of ways in which industry, academia, and the government can work together to strengthen the U.S. semiconductor industry through research, manufacturing, supply chain development, government investment, and workforce development. Paul Balentine, the author of Think Globally, Act Locally, is the

Dean W. Freeman, the author of The Semiconductor Cycle: Looking Into the Future is a technology advisor and a twice-monthly contributor to 3D InCites. He covers heterogeneous integration and sustainability topics as they pertain to the greater

digital phones (Motorola/Freescale) followed by roles with Amkor and UTAC test with a scope of 5000 testers in 7 countries. Mark has a BSEE from the University of Illinois at Urbana-Champaign & an MBA from St. Edward's University.

Sophia Oldeide, author of Fueling the Workforce Through Investment and Engagement is the Head of Marketing and Communications for ERS electronic GmbH, a manufacturer of thermal management equipment for

semiconductor industry. Dean has over 40 years of life experience in the semiconductor manufacturing and materials space, where he has had experience in nearly every sector of the semiconductor manufacturing process. He has worked both in the fab and for semiconductor equipment manufacturing companies. Dean is also a Subject Matter Expert at Kiterocket. Before joining 3D InCites, Dean was a research VP for Gartner tracking semiconductor manufacturing, process technology, and multiple aspects of the Internet of Things. He has also worked at FSI, Watkins Johnson, Lam Research, and Texas Instruments. Dean has nine process and equipment patents and has written multiple articles in various trade and technical journals. He holds a BS in Chemistry and Earth Science and an MS in Physical Chemistry.

Peter Dijkstra, the author of When Plasma Matters: Three Reasons to Choose Plasma, is Chief Commercial Officer at Trymax Semiconductor. He joined the team in 2021, coming from ASM Pacific Technology, where he served as director of sales, service,

Advanced Packaging and wafer probing based in Munich, Germany. She manages editorial and commercial content on behalf of the company, as well as event planning and public relations.

and marketing from 2014-2021. Before ASM, Peter spent his career working with plasma-based technologies in the semiconductor equipment space, including ALSI, Nanoplas, Tegal, Alcatel, and the Plasma Physics Research lab.

Monita Pau, author of Solving the AI Puzzle, is a strategic marketing director, of advanced packaging, at Onto Innovation. She has 15 years of experience in the semiconductor industry where she has held technical, marketing, and strategic

Julia Goldstein, author of Is Our Industry Moving Fast Enough on Sustainability? is principal at JLFG Communications, LLC. She is a writer and author with a materials science background, trade press experience, and the desire to never

Prasad Dhond, the author of Driving into the Future: The Next Phase in Automotive Compute Package Adoption, Is Vice President, Wirebond BGA & MLF Products at Amkor Technology, Inc. Prasad joined Amkor in 2014 and is Vice

business development roles in the capital equipment and material sectors of the value chain. Her expertise spans FEOL/BEOL process control solutions, as well as advanced packaging and assembly materials serving both core and specialty semiconductor markets.

stop learning. Julia writes the monthly Sustainability 101 blogs on 3D InCites. She shares her passion for materials and sustainability in her book Material Value, published in 2019. Material Value is a B.R.A.G Medallion Honoree, Finalist in the 2019 San Francisco Writers Contest, and Semifinalist for the 2020 Nonfiction BookLife Prize.

President, Wirebond BGA & MLF Products. He previously managed the Quad and Dual Leadframe product lines. Before joining Amkor, Prasad worked at Texas Instruments for 12 years where he held roles in product definition and marketing in the Analog product group. He holds a BSEE degree from The University of Texas at Austin and an MBA from Southern Methodist University.

Tessa Baltussen, author of How Trymax is Navigating the Talent Shortage , has led the Human Resources Department within Trymax since 2017. She holds a bachelor’s degree in Business Management and completed her Casey Krawiec, author of Thermal Simulation of a Packaged GaN MMIC is Vice President of Global Sales for StratEdge Corporation. He has worked for companies involved with wafer preparation, microelectronic assembly, and packaging for over

Kevin Rinebold, author of Five Workflows for Tackling Heterogeneous Integration of Chiplets for 2.5D/3D, is a technology manager at Siemens EDA, responsible for its heterogeneous packaging solutions. Kevin is

Abdul Lateef, the author of The Role of 200mm Manufacturing in Enabling a $1 Trillion Semiconductor Industry, is the CEO of Plasma-Therm. He has been with the organization since 1998 and was named the CEO in 2009. He has since led the organization

MS in Organization Studies.

a high-technology marketing professional with 24 years of experience in product line leadership and business development with a strong electronic design background. Effective communicator with a collaborative, entrepreneurial management style resulting in consistent business plan execution and delivery of industry-leading products. Passionate in working with customers to deliver innovative solutions while identifying new market opportunities to drive product line value and growth.

David Doyle, author of Balancing Precision and Throughput in 3D Structures with Advanced Packaging and Motion Control, is the President and Managing Director of Heidenhain Corporation. He joined the firm in 2016, serving as the Vice President of

through strategic growth initiatives, including completing over 10 acquisitions, to grow the company and expand its product portfolio. Abdul serves on the St. Petersburg College Advisory Committee, and he is a leadership coach at the University of Tampa. He founded the Plasma-Therm Foundation, a nonprofit focused on disaster relief and support. Abdul holds bachelor’s and master’s degrees in Mechanical Engineering from the University of Nebraska and an MBA from the University of Florida.

Sales and Marketing. Mr. Doyle has more than 25 years of sales and marketing experience in the international capital equipment business and technical support management.

25 years. After earning a BS in Mechanical Engineering from the University of Kentucky and an MBA from the University of Louisville, Casey was a design engineer for

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3D InCites Yearbook



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