The 2024 3D InCites Yearbook

CONTENTS CONTINUED 48 . .............. Semiconductor Industry Marketing and Communications: Learning by Doing 48 . .............. Navigating the World of Semiconductors: My Journey at Megatech By Erwan Amade, Megatech Ltd. 49 . ............. Learning About Strategic Semiconductor Communication: My Internship at Kiterocket By Mindy Lok, Kiterocket SPECIAL SECTION 50 . .............. 3D InCites Community Member Reflections: How Are We Addressing the Global Talent Shortage? 50 . .............. How Trymax is Navigating the Talent Shortage By Tessa Baltussen, Trymax Semiconductor 51 . ............. Fostering Innovation from Within By Tom Bauer, Onto Innovation 52 . .............. Fueling the Workforce Through Investment and Engagement By Sophia Oldeide, ERS electronic GmbH 53 . ............. Think Globally, Act Locally By Paul Ballentine, Mosaic Microsystems 54 . .............. 2023 In Photos 72 . .............. Ad Index

Adeia turns ideas into innovations

Our name may be new, but our roots run deep with decades of continued innovation. We invent, develop and license innovations that advance how we live, work and play.

Adeia invented and pioneered Direct and Hybrid Bonding

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ZiBond ® Wafer-to-Wafer Direct Bonding

DBI ® Ultra Die-to-Wafer Hybrid Bonding

DBI ® Wafer-to-Wafer Hybrid Bonding

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Manuela Junghähnel Fraunhofer IZM-ASSID Beth Keser International Microelectronics and Packaging Society Clemens Schütte EV Group E. Jan Vardaman TechSearch International, Inc. Visit us at www.3DInCites.com Subscribe to our e-newsletter, 3D InCites In Review: https://www.3dincites.com The 3D InCites Yearbook is published by: 3D InCites, LLC 45 West Jefferson St. Suite 700

Steffen Kröhnert European Sales steffen.kroehnert@espat-consulting.com Ph: +49 172 7201 472 Phil Garrou Contributing Editor PhilGarrou@att.net Dean Freeman

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