We-Ko-Pa Resort & Conference Center
March 18-21, 2024 12 Confirmed Professional Development Courses (PDCs) on Fan-out Wafer Level Packaging, Chiplets, System-in-Package, Flip Chip, Sensor Packaging, Wire Bonding, and more. Featuring 3 Technical Tracks and an Interactive Poster Session across 2.5 days with a record number of abstracts submitted this year! Heterogeneous 2D & 3D Integration Fan-Out, Wafer Level Packaging & Flip Chip Next Gen Applications (Automotive, 5G/6G, Photonics, HiSpeed RF)
DPC 2024 will be co-located with the Workshop on Advanced Packaging for Medical Microelectronics (March 21-22)
NEW!
Keynotes
Pooya Tadayon - Intel Hemanth Dhavaleswarapu - AMD Rajendra Pendse - Meta Sitaraman (Sita) Balasubramanian - Aptiv Pradeep Lall - Auburn University
Post Conference Events - Thursday, March 21
GOLF 4-Person Scramble 1:30 PM Shotgun Start With two award-winning golf courses set in the untouched Sonoran Desert just outside Scottsdale, Arizona, We-Ko-Pa Golf Club is truly Arizona’s Ultimate Golf Experience.
HIKING 12:30 PM - 5:00 PM For the third consecutive year, 3D InCites will be holding their Hike for the DEI fundraiser. 100% of the proceeds benefit the 3D InCItes DEI Fund; this fund is used to establish a DEI Scholarship to help young women and under-represented minorities gain access to STEM education programs at the technical school, community college and university levels. This guided, 2-hour afternoon hike takes place in the McDowell Mountains in Fountain Hills Arizona, as part of the 2024 IMAPS Device Packaging Conference.
PLATINUM SPONSOR
GOLD SPONSORS
SILVER SPONSORS
CORPORATE SPONSORS
SOLD-OUT EXHIBIT HALL!
Exhibits sold-out earlier than ever before, with a waitlist of 10+ companies.
ADDITIONAL SPONSORS
organized by the International Microelectronics Assembly and Packaging Society (IMAPS)
WWW.DEVICEPACKAGING.ORG
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