YOUR CONTRIBUTED CONTENT
3DInCites 2024-2025 Media Kit | Page 8
We accept contributions for thought-leadership blogs and technology features throughout the year. They are featured on the home page, shared on LinkedIn, and picked up in our weekly eblast. If you’re a community member, you get first choice of available publication dates in our editorial calendar and for the annual Yearbook. Your posts are archived on your member profile page. We look for original topics – but here are some hot ones to get you thinking – or just suggest your own:
Thought Leadership Solving the AI energy crisis Updates on PFAS legislation Addressing the workforce dilemma The advantages of nearshoring in the U.S. In-Depth Categories Design Design challenges and solutions for co-packaged optics Design-for-test of chiplet architectures Working chiplet with interface standards (BoW, UCIe) Design challenges and solutions for glass-core substrates Devices Meeting the requirements for AI and ML devices Advancements in co-packaged optics Power devices for automotive applications Managing device efficiency Emerging trends and target applictions for chiplets
Europe’s packaging ecosystem Building a glass substrate ecosystem Efforts to create a diverse talent pipeline Launching a successful tech start-up
Manufacturing Advanced packaging comes to the U.S.A. The impact of rapid expansion The importance of logistics to maintain a healthy semiconductor supply chain The role of data analytics in high volume manufacturing Materials Designing PFAS-free materials Solving process issues with material advancements Novel materials for advanced temporary bond/debond Advancements in IC substrates – organic/silicon/glass
Contact Françoise von Trapp
3dincites.com
978.340.0773
francoise@3dincites.com
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