WHAT IS 3D INCITES?
3DInCites 2024-2025 Media Kit | Page 2
3D InCites is your customers’ go-to resource for heterogeneous integration Headquartered in Phoenix, AZ, 3D InCites is a member-centric content platform created to support the semiconductor packaging ecosystem. With a technical focus on advanced packaging, 3D and chiplet integration, your customers come to us for
all things heterogeneous integration (HI). If it matters to you it matters to us. Your subject matter experts and thought leaders bring the most up-to-date trends and news on important topics to our community, such as: Technology advancements in processes, materials, and tools Semiconductor and microelectronics market trends The impact of geopolitics on the microelectronics industry How to achieve sustainability goals Investing in the microelectronics workforce
“ 3D InCites brings to life the people, the personalities, the ideas, and the minds behind our industry in a uniquely personal way.” RAJIV ROY, 3Lines Venture Capital
Contact Françoise von Trapp
3dincites.com
978.340.0773
francoise@3dincites.com
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