THE 2025 3D INCITES AWARDS
3DInCites 2024-2025 Media Kit | Page 17
Each year, we celebrate your efforts in innovation by hosting the 3D InCites Awards, which recognize excellence in heterogeneous integration, 3DHI, and chiplet technologies, as well as your company’s workplace culture. Since the program was started in 2013, the 3D InCites Award has become one of the most coveted prizes in the semiconductor industry. Applications for the 2025 Awards open Monday, September 16, 2024, and close Friday, October 18,
2024. Finalists will be published in the 2025 3D InCites Yearbook, and awards will be presented in a ceremony at the IMAPS Device Packaging Conference on Tuesday, March 4, 2025.
THIS YEAR’S CATEGORIES INCLUDE: Advanced Technology Enablement (Multiple Awards)
Engineer of the Year Best Place to Work (Online Vote)
To be considered, applicants must complete an online brief questionnaire and submit it no later than midnight on Friday October 18, 2024. The 3D InCites Member Advisory Board will review Advanced Technology Awards and Engineer of the Year applications. The Best Place to Work will be decided via an online vote.
Finalists will be notified in mid-November and required to complete an additional questionnaire by January 6. 2025. Winners will be notified on Tuesday, February 3, 2025. All finalists will be acknowledged in the 2025 3D InCites Yearbook. Awards will be presented in a ceremony on March 4, 2025, during the opening of the IMAPS Device Packaging Conference.
Contact Françoise von Trapp
3dincites.com
978.340.0773
francoise@3dincites.com
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