All 2025 new programs for 3D InCites Community Members.
3D InCites Media Kit 2024-2025
What is 3D InCites?
Contribute Content
The 2025 Yearbook
Who Engages With Us?
Community Member Webinars
The 2025 3D InCites Awards
Join The Community
The 3D InCites Podcast
Special Events
WHAT IS 3D INCITES?
3DInCites 2024-2025 Media Kit | Page 2
3D InCites is your customers’ go-to resource for heterogeneous integration Headquartered in Phoenix, AZ, 3D InCites is a member-centric content platform created to support the semiconductor packaging ecosystem. With a technical focus on advanced packaging, 3D and chiplet integration, your customers come to us for
all things heterogeneous integration (HI). If it matters to you it matters to us. Your subject matter experts and thought leaders bring the most up-to-date trends and news on important topics to our community, such as: Technology advancements in processes, materials, and tools Semiconductor and microelectronics market trends The impact of geopolitics on the microelectronics industry How to achieve sustainability goals Investing in the microelectronics workforce
“ 3D InCites brings to life the people, the personalities, the ideas, and the minds behind our industry in a uniquely personal way.” RAJIV ROY, 3Lines Venture Capital
Contact Françoise von Trapp
3dincites.com
978.340.0773
francoise@3dincites.com
WHY 3D INCITES?
3DInCites 2024-2025 Media Kit | Page 3
As a brand, 3D InCites is recognized throughout the semiconductor industry for our active representation at heterogeneous integration and related technology events and trade shows around the globe including: SEMICON Europa
IEEE Electronic Components Technology Conference IMAPS International Symposium SEMI Europe’s 3D System Summit And more
SEMI Industry Strategy Symposiums IMAPS Device Packaging Conference SEMICON West
We are the Official Podcast of the IMAPS Symposium, SEMICON West, and SEMICON Europa. We also podcast from IEEE ECTC. Being a guest on the podcast is benefit of community membership. It is also possible to sponsor exclusive episodes.
Official Industry Partner:
“ The 3D InCites Podcast produces engaging content that really resonates with our target audience and shared community members. Working with them as a media partner and as the official podcast for SEMICON West and SEMICON Europa has highlighted key industry trends and issues that come to life during the programs. Their staff thoughtfully cover everything from technology hot-buttons like AI and advanced packaging to top industry concerns such as sustainability and DEI.” SAMER BAHOU, SEMI
Media Partners:
Contact Françoise von Trapp
3dincites.com
978.340.0773
francoise@3dincites.com
BLOGS THAT INFORM AND INSPIRE
3DInCites 2024-2025 Media Kit | Page 4
3D InCites is host to monthly blogs tackling the most timely and critical conversations. Our in-house contributors have years of experience and thoughtful insight, to inform our readers worldwide.
Francoise in 3D Queen of 3D, Françoise von Trapp, focuses her blogs and podcast interviews on trends driving the adoption of heterogeneous and 3D integration technology. She keeps us up to date on industry happenings through participation at industry events. Packaging Insights from the Leading Edge Count on Phil Garrou’s blog to provide technical expertise on leading-edge IC packaging and the changes occurring in the IC world that underpin it. Sustainability 101 Julia Goldstein’s monthly sustainability blog posts are dedicated to helping you and your customers learn best practices in sustainable semiconductor manufacturing.
3D In Context Long-time semiconductor manufacturing and materials expert, Dean Freeman offers insights into the semiconductor market and its technology drivers. He also follows the progress of sustainable semiconductor manufacturing efforts. Interconnectology 101 Jillian Carapella brings a fresh voice to 3D InCites by helping industry newcomers learn the ropes. Follow along as she explores the world of heterogeneous integration, 3D and chiplets, through the eyes of your company’s subject matter experts. From Different Dimensions You too can contribute as a guest blogger and showcase your products and services to our community.
“ For more than 15 years, IMAPS has collaborated with 3D InCites. Through its editorial promotions, partnerships and continued support, The 3D InCites team is the reason for the great success of our signature events – IMAPS Symposium on Microelectronics and the Device Packaging Conference. We truly appreciate their unique perspective that focuses on the people who make our industry thrive. I am beyond excited for our ever-expanding partnership.” BRIAN SCHIEMAN, Executive Director, IMAPS
Contact Françoise von Trapp
3dincites.com
978.340.0773
francoise@3dincites.com
WHO ENGAGES WITH US?
3DInCites 2024-2025 Media Kit | Page 5
We are the authorities on heterogenous integration and 3D technology. Our community is broad and varied. Your customers may be our visitors, or they could be other member companies. All of them count on us to help them make informed decisions for their companies. Our top followers include: Investors Technophiles Business professionals (sales, marketing, business development) Engineers Academics and researchers The primary interests of those followers include: Investment services Computers and computer accessories, electronics/electronic components, chips & processors Consumer electronics/mobile phones, Internet and telecom Software
Contact Françoise von Trapp
3dincites.com
978.340.0773
francoise@3dincites.com
WE ATTRACT A GLOBAL AUDIENCE
3DInCites 2024-2025 Media Kit | Page 6
BENEFIT FROM WORLD WIDE EXPOSURE
Our global community is 57,000 strong representing 118 countries.
We reach the regions that matter most to the semiconductor industry
16 %
30 %
53 %
1 %
Asia
Americas
Europe
ROW
As the industry works to build the next-generation workforce, we’re already reaching them. We have the highest level of engagement with millennials and Gen Z. 18-24 (Gen Z): 19 % | 25-44 (Millennials): 44 % | 45-54 (Gen X): 22 % | 55+ (Boomers): 15 %
Quality Beats Quantity When you’re competing with AI-generated content to reach your target audience, quality counts. Our original content delivers accurate and current answers to your customers most pressing concerns.
We Engage with You Success on social media platforms means more than just posting articles, photos and videos. We actively engage with our followers, members, and industry partners to help elevate all our messages to the entire semiconductor and microelectronics industry.
Shouldn’t YOUR COMPANY be members?
Contact Françoise von Trapp
3dincites.com
978.340.0773
francoise@3dincites.com
THIS. IS. COMMUNITY.
3DInCites 2024-2025 Media Kit | Page 7
As a part of the 3D InCites Community, you get more than just a place to share original content and important news. We represent you at industry events, create engagement on social media platforms like LinkedIn and Instragram, and include your voice on our podcast. Our 3D InCites Awards program recognizes your achievements, and our Yearbook showcases your participation. It all starts with a 3D InCites Community Membership. Choose the plan that’s right for you.
Benefits
Basic Member
Premium Member
Elite Member
Logo on Home Page
Profile Page
Contribute Blogs and Articles
Monthy Member News
Industry Event Previews
Social Engagement
Member of the Week
Featured Video of the Week
Podcast Member Spotlight
3 month Banner Ads
3 month ROS Banner Ad
Staff Written Interview
Exclusive Podcast Episode
Annual Membership Fee
$2,000.00
$3,800.00
$7,500.00
“ Our industry is built on ecosystems that drive innovation and change the world. Technology is fast-moving, as is today’s media coverage. At ASE, we recognize the tremendous value of our 3DInCites membership and community. The 3DInCites member platform not only gives us a front seat at the bleeding edge of what’s going on, but also brings opportunities for us to learn, collaborate, network, and perhaps most importantly, share our perspectives on the transformative advanced packaging innovations that are enabling AI proliferation and ultimately making our world safer, healthier, greener, and infinitely more efficient.” PATRICIA MACLEOD, ASE
Contact Françoise von Trapp
3dincites.com
978.340.0773
francoise@3dincites.com
YOUR CONTRIBUTED CONTENT
3DInCites 2024-2025 Media Kit | Page 8
We accept contributions for thought-leadership blogs and technology features throughout the year. They are featured on the home page, shared on LinkedIn, and picked up in our weekly eblast. If you’re a community member, you get first choice of available publication dates in our editorial calendar and for the annual Yearbook. Your posts are archived on your member profile page. We look for original topics – but here are some hot ones to get you thinking – or just suggest your own:
Thought Leadership Solving the AI energy crisis Updates on PFAS legislation Addressing the workforce dilemma The advantages of nearshoring in the U.S. In-Depth Categories Design Design challenges and solutions for co-packaged optics Design-for-test of chiplet architectures Working chiplet with interface standards (BoW, UCIe) Design challenges and solutions for glass-core substrates Devices Meeting the requirements for AI and ML devices Advancements in co-packaged optics Power devices for automotive applications Managing device efficiency Emerging trends and target applictions for chiplets
Europe’s packaging ecosystem Building a glass substrate ecosystem Efforts to create a diverse talent pipeline Launching a successful tech start-up
Manufacturing Advanced packaging comes to the U.S.A. The impact of rapid expansion The importance of logistics to maintain a healthy semiconductor supply chain The role of data analytics in high volume manufacturing Materials Designing PFAS-free materials Solving process issues with material advancements Novel materials for advanced temporary bond/debond Advancements in IC substrates – organic/silicon/glass
Contact Françoise von Trapp
3dincites.com
978.340.0773
francoise@3dincites.com
YOUR CONTRIBUTED CONTENT
3DInCites 2024-2025 Media Kit | Page 9
Processes and Technology Temporary bonding and debonding challenges and solutions for hybrid bonding Advancements in deposition processes for high-density interconnects Addressing process challenges of glass core substrates Alternatives to hybrid bonding
Test and Inspection The importance of process control in chiplet devices The difference between metrology and inspection Test challenges and solutions for chiplet integration
Editorial Guidelines Don’t see a topic that fits your technology or expertise? Pitch us your idea: Send a 300-word abstract of your contributed piece to francoise@3DInCites.com. Contributions should include: Posts: 500-1500 words, with up to five figures provided in .jpg or .png format, and under 2MB file size. White papers can be any length but should be submitted as a downloadable .pdf file. Include a 500-word executive summary. Please provide a 1200 X 700 conceptual image or “beauty shot” (1200 x 700 pixels wide). Videos: Provide YouTube or Vimeo link Author headshot, title, email and brief bio to create a profile. This is your byline and all posts by you will be linked to it.
Contributors retain their own copyright however we do prefer that feature contributions be original for 3D InCites. Subsequent publication in other media sources should include the statement that this article “appeared first on 3D InCites” with a link to the post.
Contact Françoise von Trapp
3dincites.com
978.340.0773
francoise@3dincites.com
SPONSORED CONTENT
3DInCites 2024-2025 Media Kit | Page 10
Gain exposure through our well-read content
SPONSOR YOUR FAVORITE BLOGGER $1000/month Make your company the exclusive name sponsor of your favorite blogger. Six month minimum commitment. CUSTOM WHITE PAPER PROGRAM starting at $3500/ 6 month minimum Branded White Paper featured on the home page. Includes: Landing page with registration Lead capture/reporting Each paper featured in one eNL Blast Promoted on LinkedIn
SPONSORED BLOG POSTS $500/issue Your company blog post will be featured in 3D InCites In Review. Feature image, and headline links to the full post on your company blog. 3D INCITES IN REVIEW - WEEKLY ENEWSLETTER $500/issue, 8-week minimum With qualified audience and maximum open rate, you can be sure that by advertising in our weekly eNL, you’re putting your brand in front of the most engaged members of the microelectronics industry every week.
“ We at Deca truly enjoy the energy and enthusiasm of being a 3D InCites community member along with the visibility it brings across a broad industry audience. What a great forum for sharing insights and achievements through podcasts, interviews, white papers, and more!” TIM OLSON, DECA
Contact Françoise von Trapp
3dincites.com
978.340.0773
francoise@3dincites.com
COMMUNITY MEMBER WEBINARS
3DInCites 2024-2025 Media Kit | Page 11
3D InCites Community Members are invited to partner with 3D InCites on your next webinar*. We’ll work with you to develop the topic, secure speakers, and handle all the event logistics, lead generation, and promotion. We work with experienced web hosting platform partners to provide a professional experience. With 3D InCites as your co-sponsor and one of our industry experts as your moderator, you can be sure to reach your target audience. “ It was great to benefit from Françoise experience and network, which made it easy for us to focus on delivering the right message to the 3D InCites community. We got amazing feedback and a lot of interactions during and after the webinar which exceeded our expectations.” RICHARD NOAK, LPKF Laser & Electronics SE
FULL WEBINAR PACKAGE $8000 Management of all event logistics including podcast platform and back-end support Lead gathering and reporting Use of 3D InCites’ branding on all promotional materials Hosting/moderating, content planning, practice sessions, and live event One co-branded, exclusive email blast to the 3D InCites Mailing list 2 months home page event box banner ad (one month before the event and one after for the recorded version) 4 weeks of advertising in the 3D InCites InReview e-blast Inclusion in 3D InCites event calendar Archived for 1 year on the platform with a link from 3D InCites
WEBINAR LITE $6000 Use of 3D InCites’ branding on all promotional materials Hosting/moderating, content planning, practice session and live event One co-branded, exclusive email blast to the 3D InCites Mailing list 2 months home page event box banner ad (one month before the event and one after for the recorded version) 4 weeks of advertising in the 3D InCites InReview eblast Inclusion in 3D InCites event calendar Archived for 1 year on platform with link from 3D InCites
Contact Françoise von Trapp
3dincites.com
978.340.0773
francoise@3dincites.com
A VISIT FROM THE QUEEN
3DInCites 2024-2025 Media Kit | Page 12
$6500 + travel expenses Ready to promote your company as a great place to work and showcase your town as a great place to live? Then roll out the red carpet for the Queen of 3D*. Françoise von Trapp will spend a day at your company HQ meeting and interviewing your staff to get their story and testimonials. Give her the royal tour of your facility and town, and she’ll take photos and videos to share on social media. She’ll sit down with your executives to produce an exclusive 3D InCites podcast. Highlights of the visit will be featured in the next issue of the Yearbook. Visit includes: Planning meetings to determine visit strategy Half a day at the facility Half a day touring the region and meeting with local officials.** Blog post
Social media posting on LinkedIn, Facebook and Instagram Podcast production, promotion, and distribution One month banner advertising on 3D inCites Final content delivered for use as recruitment tools on your website
*Only available to 3D InCites community members **Host company organizes these interviews
Contact Françoise von Trapp
3dincites.com
978.340.0773
francoise@3dincites.com
3D INCITES PODCAST
3DInCites 2024-2025 Media Kit | Page 13
The Premiere Microelectronics Industry Podcast With more than 130 episodes under our belt, we’ve already surpassed 20,000 downloads. Listeners tune in from all over the world to hear what our guests are saying about the semiconductor industry.
Who’s Listening
Europe Downloads - 20% 3,835
Asia Downloads - 22% 4,285
North America Downloads - 57% 10.2K
Africa Downloads - 0% 38
South America Downloads - 0% 35
Oceania Downloads - 1% 284
From Where?
Top App
Top Device
Top Category
Apple Podcasts 37%
Apple iPhone 53%
Mobile 60%
Contact Françoise von Trapp
3dincites.com
978.340.0773
francoise@3dincites.com
PODCAST RATES
3DInCites 2024-2025 Media Kit | Page 14
EXCLUSIVE SPONSORED PODCAST $1200/episode Topic/content/speakers decided by the sponsor Hosted by Françoise* Featured in eblast and on home page (minimum one week) Promoted on social media Archived on 3D InCites Podcast website Includes post-production and distribution across podcast channels 3D INCITES EDITORIAL PODCAST $250 per ad/per episode Content is developed by 3D InCites team. Speakers are invited. Focus is on an editorial topic. New episodes dropped weekly, featured on home page, in eblast, and on LinkedIn and Twitter. Podcast is available on Spotify, Apple Podcasts, Stitcher, and multiple other podcast directories. Multiple advertisers possible Ads are host-read, and inserted into the episode. Company logo and brief text included in the show notes
SUPPORT THE 3D INCITES PODCAST $3, $5, $8, or $10/month For the cost of a cup of coffee, you can help us continue creating great episodes. Choose the amount that’s right for your budget, and get a shout out in an upcoming episode! SUPPORT OUR PODCAST
* Guest hosts may require additional fees.
Contact Françoise von Trapp
3dincites.com
978.340.0773
francoise@3dincites.com
THE YEARBOOK
3DInCites 2024-2025 Media Kit | Page 15
Our annual Yearbook digital issue provides a snapshot of our member activities of the previous year, while also focusing on their perspectives of what lies ahead. The 2025 Yearbook will be available January 2025. What was the microelectronics industry talking about in 2024? Topics that come to mind: The fluctuating semiconductor market, anticipated growth, disbursement of Chips Act Funds in the U.S. and Europe and the resulting industry expansion; ongoing sustainability efforts- particularly with PFAS legislation, the competition for STEM talent, and more. Members are invited to contribute executive viewpoints on these topics, as well as important technical advancements . Check out the topics on page 8 of this Media Kit for a complete list. . or pitch us your idea! Abstracts are due August 1, 2024 and final articles are due October 15, 2024. All contributions will also be posted on the 3D InCites website throughout Q1 and Q2 of 2025. Cover Feature This year’s cover story will highlight Hot Spots in Advanced Packaging. As these technologies take center stage, we’ll look at where in the world we’re seeing expansion . Is Advanced Packaging growing in your part of the world? We want to know about it . 3D InCites Awards Finalists All finalists for the 3D InCites Awards will be featured in a special section. Learn more about the 2025 Award Program on Page 17. Community Reflections Community members, are you experiencing growth in your region ? Then we want to hear it! Send us 500 words and a photo by October 15, 2024. All contributors should submit a headshot and brief bio for inclusion in our contributors’ page.
What’s a Yearbook without Photos? A community is all about the people who make it happen. Each year, we feature photos that we take of you at Industry Events around the globe. But we can’t be everywhere! We invite our members to send in photos for consideration. Please provide high resolution .jpg format and be sure to include the name of the event, date, and people in the photo.
Contact Françoise von Trapp
3dincites.com
978.340.0773
francoise@3dincites.com
THE YEARBOOK
3DInCites 2024-2025 Media Kit | Page 16
Digital publication date is January 7, 2025
Our 2024 Yearbook to date has been viewed more than 3K times. Our 2023 issue continues to draw views and is close to 6K views. The online flipping book supports video ads, email links, and links to your website or any URL. It can also be downloaded as a PDF. Advertise in the 2025 issue and also get 3 months of banner advertising on the website. Yearbook Ad Rates
YEARBOOK ADS
RATE
AD SPECS PRINT BANNER ADS
978 x 90 or 300 x 250 978 x 90 or 300 x 250 978 x 90 or 300 x 250 978 x 90 or 300 x 250 978 x 90 or 300 x 250 978 x 90 or 300 x 250
Inside Front Cover + ROS Banner Ad x 3 months
$4,000
8.5x11 in
Back Cover + ROS Banner Ad x 3 months
$2,000
8.5x11 in
Inside Back Cover + ROS Banner Ad x 3 months
$3,500
8.5x11 in
Two-Page Spread + ROS Banner Ad x 3 months
$4,500
11x17 in
Full Page + ROS Banner Ad x 3 months
$3,000
8.5x11 in
Half Page Horiz. + Tag/category Banner Ads x 3 months
$2,000
8.5x5.5 in
Ad Specs: .JPG file type RGB color
Editorial contributions due: October 15, 2024 Ad space close: November 3, 2024 Final art due: December 1, 2024
No bleed or trim is necessary, although it is helpful to leave .25 to .5 inch margins on all sides and to keep all text and logos .75 inch away from the gutter on 2 page spreads 144 dpi minimum Video files accepted: YouTube, Vimeo, Wista
Contact Françoise von Trapp
3dincites.com
978.340.0773
francoise@3dincites.com
THE 2025 3D INCITES AWARDS
3DInCites 2024-2025 Media Kit | Page 17
Each year, we celebrate your efforts in innovation by hosting the 3D InCites Awards, which recognize excellence in heterogeneous integration, 3DHI, and chiplet technologies, as well as your company’s workplace culture. Since the program was started in 2013, the 3D InCites Award has become one of the most coveted prizes in the semiconductor industry. Applications for the 2025 Awards open Monday, September 16, 2024, and close Friday, October 18,
2024. Finalists will be published in the 2025 3D InCites Yearbook, and awards will be presented in a ceremony at the IMAPS Device Packaging Conference on Tuesday, March 4, 2025.
THIS YEAR’S CATEGORIES INCLUDE: Advanced Technology Enablement (Multiple Awards)
Engineer of the Year Best Place to Work (Online Vote)
To be considered, applicants must complete an online brief questionnaire and submit it no later than midnight on Friday October 18, 2024. The 3D InCites Member Advisory Board will review Advanced Technology Awards and Engineer of the Year applications. The Best Place to Work will be decided via an online vote.
Finalists will be notified in mid-November and required to complete an additional questionnaire by January 6. 2025. Winners will be notified on Tuesday, February 3, 2025. All finalists will be acknowledged in the 2025 3D InCites Yearbook. Awards will be presented in a ceremony on March 4, 2025, during the opening of the IMAPS Device Packaging Conference.
Contact Françoise von Trapp
3dincites.com
978.340.0773
francoise@3dincites.com
3D INCITES AWARDS SPONSORSHIPS
3DInCites 2024-2025 Media Kit | Page 18
PLATINUM SPONSORSHIP $8000 (Three available) Participation in the presentation of awards at the Awards Ceremony Recognition as Platinum Sponsor with top-level branding from the start of the program through 2025: 3D InCites Award Program page 3D InCites Awards ad on home page 3D InCites Award Winners’ showcase page
GOLD SPONSORSHIP $5000 (Six available) Recognition as Silver Sponsor with second-tier branding from the start of the program through 2025: 3D InCites Award Program page 3D InCites Awards ad on home page 3D InCites Award Winners’ showcase page Logo and Sponsorship mention during the Award Ceremony Sponsorship showcased in the 2025 3D InCites Yearbook 3 months banner advertising - best position available
3D InCites Podcast Sponsor Sponsorship showcased in the 2025 3D InCites Yearbook 3 months run of site banner ad
SILVER SPONSORSHIP $2000 (Ten available) Recognition as Gold Sponsor with third- tier level branding from the start of the program through 2025: Logo placement/branding on: 3D InCites Award program pages 3D InCites Award Winners’ showcase page Sponsorship mention during the Award Ceremony Sponsorship showcased in the 2025 3D InCites Yearbook 3 months of banner advertising based on tags
Contact Françoise von Trapp
3dincites.com
978.340.0773
francoise@3dincites.com
2025 HIKE FOR DEI
3DInCites 2024-2025 Media Kit | Page 19
South Mountain Park, Phoenix, AZ, March 6, 2025 For the third consecutive year, we’ll be holding our guided, 2-hour afternoon Hike for DEI fundraiser at the close of the 2023 IMAPS Device Packaging Conference. 100% of the proceeds benefit the 3D InCItes DEI Fund, established to give young women and under-represented minorities access to STEM education programs at the technical school, community college, and university levels. EVENT SPONSORSHIP $7500 donation Acknowledgement as premier sponsor on: 3D inCites website In the 2025 Yearbook All promotional materials Social media posts on LinkedIn, Facebook, and Instagram before and after the hike
SWAG SPONSOR $1000 donation Opportunity to provide your branded items to be included in the hike backpack. Sunscreen Water bottle (24 oz min) Hat Logo featured on the back of the commemorative t-shirt Mention in all promotional materials T-SHIRT LOGO SPONSOR $500 donation Logo featured on back of commemorative t-shirt
The logo featured on the front of the commemorative t-shirt and backpack Photos of hike published in 2025 Yearbook PICNIC SPONSOR $2500 donation Logo on box lunch provided by REI, our hiking outfitter, and will be enjoyed under a ramada at the trailhead before the hike Acknowledgment as lunch sponsor on the 3D InCites website Acknowledgment in the 2025 Yearbook Mention in all promotional materials The logo featured on the back of the commemorative t-shirt
Contact Françoise von Trapp
3dincites.com
978.340.0773
francoise@3dincites.com
MEMBER SOCIAL EVENT SPONSORSHIPS
3DInCites 2024-2025 Media Kit | Page 2 0
BACKYARD OLYMPICS IMAPS Device Packaging Conference, March 5, 2025 The inaugural 3D InCites Backyard Olympics was such a hit, we’re doing it again! This is your opportunity to mix and mingle with your 3D InCites community and possibly show off some hidden talents. Participate in six game stations, targeting 10 teams of four people each. Enjoy light snacks and an open bar. Medals are awarded to the winning team of each event. Games include:
Backyard Olympics 2025
Cornhole Putting Tabletop ring toss
Ax throwing Pong Hula hoop
TITLE SPONSOR $3500 (one available) Logo on Welcome sign - Hosted by your company Logo on step-and-repeat for team photo backdrop and awards Acknowledgement as Food and Beverage sponsor Opportunity to display corporate banner Acknowledgement on social media posts Logo on competitor t-shirts
GAME SPONSORS $700 Logo at game station
Logo on back of commemorative T-shirt Acknowledgement on social media posts
Contact Françoise von Trapp
3dincites.com
978.340.0773
francoise@3dincites.com
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