The 2025 3D InCites Yearbook

21 ST INTERNATIONAL CONFERENCE & EXHIBITION ON

New Location!

SHERATON GRAND AT WILD HORSE PASS PHOENIX, AZ WWW.DEVICEPACKAGING.ORG

March 3-6, 2025 16 Professional Development Courses, a Global Business Council Plenary Session, interactive poster session, evening panel discussion, and more! Featuring 3 Technical Tracks across four days with a record number of abstracts submitted this year!

New Venue for DPC 2025! Sheraton Grand at Wild Horse Pass, Phoenix, AZ

DPC 2025 is also co-located with the Workshop on Advanced Packaging for Medical Microelectronics (March 5–7)

Four Keynotes

2nd Annual 3D InCites Backyard Olympics!

Hemanth Jagannathan, IBM Sung Jin Kim, Absolics, Inc. JB Baker, Scaleflux Luu Nguyen, PSI Quantum

March 5th • 7–9 pm in conjunction with the DPC/Medical Workshop Poster Session Grab your team and compete in various game stations!

Heterogeneous 2D & 3D Integration Fan-Out, Wafer, Panel Level & Flip Chip Packaging Emerging Technologies

HIKING This guided afternoon hike takes place in nearby South Mountain Park, as part of the 2025 IMAPS Device Packaging Conference. Post Conference Events - Thursday, March 6 GOLF 4-Person Scramble 1:30 PM Shotgun Start More information to come!

PLATINUM SPONSOR

GOLD SPONSORS

SILVER SPONSORS

CORPORATE SPONSORS

EXPANDED SOLD-OUT

SUPPORTING SPONSORS

EXHIBIT HALL! Exhibits for 2025 are expanded from 66 to 84.

OFFICIAL INDUSTRY PARTNER

organized by the International Microelectronics Assembly and Packaging Society (IMAPS)

WWW.DEVICEPACKAGING.ORG

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