CONTRIBUTING AUTHORS Todd Burkholder , co-author of Taking 3D IC Heterogeneous Integration Mainstream , is Senior Writer and Editor at Siemens DISW, working with SMEs and customers to create content for the majority of EDA technology divisions at Mentor Graphics and Siemens from 1997 on. He began his career Dean W. Freeman , the author of Asia May Still Be the Hottest Spot for Advanced Packaging , is a technology advisor and a twice- monthly contributor to 3D InCites. He covers heterogeneous integration and sustainability topics as they
and process technology departments. Lindner also leads customer orientation throughout all steps of product development, innovation and implementation in a production environment. He joined the company in 1988 as a mechanical design engineer and has since pioneered various semiconductor and MEMS processing systems, which have set industry standards. Prior to his appointment as executive technology director, Lindner established a product management department at EV Group. During that time, he was involved in marketing, sales, manufacturing, and on-site process support.
IBM’s AI hardware partner ecosystem. Dr. Sikorski started his career in 1989 with IBM Microelectronics holding positions in R&D, manufacturing, product line management, business development and complex deal negotiation over a 20-year period. He rejoined IBM in 2020 after a decade at STATS ChipPAC and JCET. Dr. Sikorski served on the Boards of Directors of industry organizations iNEMI and MEPTEC for several years. He received his Bachelor of Science degree from Columbia University’s School of Engineering and Applied Sciences in Metallurgical Engineering and his master’s degree and Ph.D. from the Massachusetts Institute of Technology, both in Materials Engineering.
pertain to the greater semiconductor industry. Dean has over 40 years of life experience in the semiconductor manufacturing and materials space, where he has had experience in nearly every sector of the semiconductor manufacturing process. He has worked both in the fab and for semiconductor equipment manufacturing companies. Dean is also a Subject Matter Expert at Kiterocket. Prior to joining 3D InCites, Dean was a research VP for Gartner tracking semiconductor manufacturing, process technology, and multiple aspects of the internet of things. He has also worked at FSI, Watkins Johnson, Lam Research, and Texas Instruments. Dean has 9 process and equipment patents and has written multiple articles in various trade and technical journals. He holds a BS in Chemistry and Earth Science and an MS in Physical Chemistry.
Tony Mastroianni , co-author of Taking 3D IC Heterogeneous Integration Mainstream , is the Advanced Packaging Solutions Director at Siemens Digital Industries Software. He has more than 30 years’ experience as an engineer and
in high-technology marketing in 1992 after earning a Bachelor of Science at Portland State University and a Master of Arts degree from the University of Arizona.
Jim Straus , author of Cost-effective, High-performance Chips Are Driving the Move to Panel-level Processing , has served as ACM’s Vice President of Sales for North America since April 2020. He has 30 years of experience in semiconductor equipment sales,
Jillian McNichol , author of How Arizona is Growing its Advanced Packaging Capabilities , is a technology blogger with more than seven years of experience covering a variety of topics in the microelectronics space. Jillian’s
engineering manager in the global semiconductor industry and currently leads development of advanced packaging solutions for Siemens EDA. Prior to joining Siemens, he served in engineering leadership positions at Inphi and eSilicon. Tony earned a B.S.E.E from Lehigh University and a M.E.E at Rutgers University.
business development, account management, and operations supporting leading global semiconductor manufacturers. Jim holds a BS from the United States Military Academy, West Point, and an MBA from Fisher College of Business at The Ohio State University.
blog, Interconnectology 101 is featured regularly on 3D InCites. Her primary focus is technology trends such as AI and machine learning. She’s also covered semiconductor manufacturing and advanced packaging processes. Jillian holds a bachelor's degree in journalism and mass communication from Arizona State University.
Camden McCrea , author of From Words to a World of Chips: My Experience with IMAPS and The International Symposium is an Honors International Studies student at Texas A&M University with additional studies in Business
Ramachandran (Ram) Trichur , author of Face It: Live Events Strengthen Partnerships and
Avery Gerber , author of US- JOINT Consortium: Strengthening Advanced Packaging Innovation Across Borders is a 3D InCites Community Intern. Currently pursuing a degree in International Studies and Journalism at Texas A&M University,
Influence Product Innovation is the Global Market & Strategy Head for Semiconductor Packaging at Henkel Adhesive Technologies, Electronics. With over 20 years of expertise in semiconductor industry in variety of roles with hands-on experience in wafer fabs and in heading business for specialty chemicals for electronics manufacturing, Ram oversees strategic and financial objectives for the market at Henkel. Ram holds an M.S. in Electrical Engineering from the University of Cincinnati and completed executive education in Business Management at Stanford Graduate School of Business. He holds 3 patents and has authored over 40 publications in leading conferences and industry journals.
Peter Dijkstra , the author of 2024: A Year of Growth and Innovation , is Chief Commercial Officer at Trymax Semiconductor. He joined the team in 2021, coming from ASM Pacific Technology, where he served as director of sales, service, and
Administration and Spanish. Writing, communication, and people are his passions and he hopes to combine all three to connect with and learn about people all around the globe.
Avery brings a passion for written communication and a keen interest in the ever-evolving landscape of technology.
marketing from 2014-2021. Prior to ASM, Peter spent his career working with plasma-based technologies in the semiconductor equipment space, including ALSI, Nanoplas, Tegal, Alcatel, and the Plasma Physics Research lab.
Juliana Panchenko , co- author of “The “White House of Microelectronics Packaging” Celebrates 15th Anniversary!” , is a head of the group “Micro-/ Nano Interconnect” at Fraunhofer IZM-ASSID since 2014. She
Julia Freer , author of What You Need to Know About PFA S, is an author and business owner on a mission to make manufacturing more environmentally responsible. She has a background in engineering, journalism, content writing,
holds a professorship at the Institute for Electronics Packaging Technology at TU Dresden. She has 14 years of experience in academia and research institutes and focuses on development and characterization of new interconnect technologies for fine-pitch applications of microelectronic packaging. She is an author of around 60 scientific publications.
Frank Windrich, Ph.D. co- author of “The “White House of Microelectronics Packaging” Celebrates its 15th Anniversary!” , is deputy head of Fraunhofer
Isabella Drolz , author of Bridging the Semiconductor Talent Gap – The Role of the European Chips Act and Beyond , serves as the Vice President of Marketing & Product Strategy at Comet AG’s X-ray Systems Division. In her role, Isabella oversees Market
and teaching and holds a Ph.D. in materials science. Julia’s company, JLFG Communications, works with manufacturers to help them connect business goals, environmental action, and effective communication strategies. Julia’s first book, Material Value, is a B.R.A.G Medallion Honoree, Finalist in the 2019 San Francisco Writers Contest, and Semifinalist for the 2020 Nonfiction BookLife Prize. She is also the author of Rethink the Bins, which received a Gold award from the Nonfiction Authors Association, Beyond the Green Team, and Materials & Sustainability.
IZM-ASSID and leads the group “Lithography and Polymers for Wafer-Level Packaging“. He joined Fraunhofer IZM- ASSID in 2010 and realized multiple industry R&D projects in the field of advanced 3D wafer-level packaging, and wafer-scale integration technologies. He holds a degree in chemical engineering and doctoral degree in polymer chemistry.
and Product Management, Global Application & Training Centers, Marketing, and the Academia Program. She holds a degree in industrial engineering, a Bachelor of Science in International Business Administration, and an MBA from Southern Nazarene University in Oklahoma City, USA. With a strong background in mechanical and plant engineering, Isabella has held several management roles focused on market-driven product and business development.
Dr. Scott Sikorski , author of Empowering the Future: New York's Semiconductor Surge in 2024 is responsible for business development and offering management for the IBM Bromont OSAT facility as well as for driving
Paul Lindner , author of Navigating the European Chip Renaissance is EV Group’s executive technology director. He heads the R&D, product and project management, quality management, business development
the IBM Research Heterogeneous Integration and Chiplet ecosystem development. He also guided development of
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