Engineer of The Year Finalists
Nordson Test & Inspection
Nordson Test & Inspection’s revolutionary SpinSAM Acoustic Microscopic Imaging (AMI) system sets a new standard for wafer inspection in semiconductor manufacturing. With a compact footprint and unmatched throughput, SpinSAM scans up to four 300mm wafers simultaneously using proprietary non-immersion transducers, ensuring streak-free, high-resolution imaging while minimizing contamination risks. The system delivers complete wafer images without stitching in under six minutes, supporting diverse applications like bonded wafers and MEMS. Features like global tool matching, continuous operation, and efficient repairs streamline production, making SpinSAM a cutting-edge solution for high-yield, high-quality semiconductor inspection.
Rex Anderson
Rex Anderson, PhD, Director of Operations at Micross, is leading the company’s largest project under the DoD RESHAPE program: establishing a secure 300mm wafer bumping and finishing facility. With over 25 years of semiconductor expertise and a PhD in Nuclear Engineering from the University of Michigan, Rex has a track record of innovation at Applied Materials, Amkor, and RTI Microsystem Integration. His leadership on the SCAPEx project includes procuring and qualifying over 90 tools, overseeing complex facility modifications, and ensuring backward compatibility for diverse wafer sizes. Through meticulous planning and collaboration, Rex has kept the project on schedule and within budget, with the 300mm line set to launch by late 2025, solidifying Micross as a leader in advanced wafer processing. Dmitry Padrubny, Lead Application Engineer at Finetech, has over 20 years of experience in advanced semiconductor packaging, with nearly a decade at Finetech specializing in sub-micron die bonding for 2.5D and 3D integration. A graduate of Minsk Engineering College, Dmitry is instrumental in optimizing bonding processes for customers ranging from university labs to multinational corporations, addressing challenges in photonics, Lidar, Quantum, and AI. Recognized for his problem-solving and hands-on approach, he leads Finetech’s North American technical team, mentoring colleagues and enhancing customer collaboration. Dmitry's contributions, including spearheading a cleanroom build for process development, drive Finetech’s success in advancing heterogeneous integration from prototype to production.
Siemens Digital Industries Software Siemens Digital Industries Software is advancing 2.5D/3D IC heterogeneous integration with its Innovator3D IC platform, introduced in September 2024. This AI-enhanced co-design tool enables system-centric planning for die, interposer, package, and PCB design, ensuring seamless digital continuity. Innovator3D IC leverages predictive modeling for power, performance, area, cost, and reliability optimization, supporting interfaces like UCIe, HBM, and BoW. By providing early insights into thermal, mechanical, and electrical performance, it reduces design iterations and accelerates development. This comprehensive solution empowers engineers to create optimized, production-ready designs, transforming semiconductor design workflows.
Dmitry Padrubny
Innovator3D IC is a 2.5/3D heterogeneous integration planning cockpit for multi-die and chiplet based semiconductor devices
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Saras Micro Devices Saras Micro Devices is redefining power delivery for high-performance computing (HPC) and AI applications with its innovative STile embedded capacitor and voltage regulator solutions. These products enable embedded vertical power delivery (eVPD), reducing
power delivery losses and improving efficiency by shortening the power pathway and minimizing the need for surface-mount components. This approach supports higher power densities in compact designs, unlocking the full potential of chiplet-based, multi-device architectures. Manufactured in Chandler, AZ, Saras collaborates with leading semiconductor suppliers to tailor STile solutions, accelerating design cycles and advancing integration for next-gen processors.
2025
MacDermid Alpha Electronics Solutions MacDermid Alpha Electronics Solutions addresses key challenges in heterogeneous integration (HI) and hybrid bonding with its NOVAFAB Fine Grain Copper electroplating process. Designed for high-density interconnects, this ultra-pure copper film ensures controlled grain growth during annealing, enabling defect-free bonds and enhanced device reliability. With a sub-2μm grain size, it minimizes signal degradation and meets the mechanical and electrical demands of advanced applications. Seamlessly
integrating into high-volume manufacturing, NOVAFAB supports the performance and yield requirements of 3D
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stacking and chiplet integration, making it a reliable and scalable solution for next-gen electronics.
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3D InCites Yearbook
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