Announcing the 2025 3D InCites Awards Finalists By Avery Gerber For the 2025 3D InCites Awards, we settled on three distinct categories: Technology Enablement, Engineer of the Year, and Best Place to Work. These categories highlight the incredible contributions and efforts made by companies and individuals within the semiconductor and advanced packaging industries. The Technology Enablement Awards will honor companies that have identified and solved critical challenges in the commercialization and manufacturing of HI, 3D HI, and chiplet architectures, driving the industry forward through cutting-edge solutions and advancements. Engineer of the Year recognizes one individual whose technical expertise, innovation, and leadership have significantly impacted the development and implementation of technologies that shape the future of semiconductor packaging and integration. Best Place to Work will celebrate companies that have fostered outstanding work environments, where innovation, collaboration, employee well-being, and professional growth are paramount, creating spaces where employees thrive both personally and professionally. All the finalists for these awards demonstrate exceptional commitment to pushing the boundaries of technology, promoting diversity, fostering strong workplace cultures, and driving the future of the semiconductor industry.
Resonac
heterogeneous integration and chiplet packaging, the company developed the JOINT2 Consortium, which focused on fine pitch bonding, underfill materials, and advanced processes like semi-additive plating and polymer damascene. Achievements include successful 10 μm pitch bonding with flux-less technology and demonstrated 1/1 μm line/space capabilities. Building on this success, Resonac is leading the US-JOINT consortium in Silicon Valley, partnering with 10 global manufacturers and institutions like the Texas Institute for Electronics to accelerate R&D in advanced packaging. This initiative fosters collaboration across materials, equipment, and design to fast-track commercialization and innovation.
Resonac plays a pivotal role in advancing semiconductor performance through innovative packaging technologies and ecosystem collaboration. To address challenges in
Onto Innovation Onto Innovation is driving advancements in chiplet integration and high-performance packaging with its Packaging Applications Center of Excellence (PACE) in Wilmington, Massachusetts. PACE focuses on co-developing next-gen architectures and packages alongside key industry partners, addressing challenges like shrinking line/space (l/s) requirements and the shift to glass core substrates for enhanced stability and electrical performance. The facility features Onto’s JetStep ® lithography system for sub-1.5μm l/s imaging, Firefly G3 inspection tools for glass panel metrology, and the Discover Command Center for AI-driven process controls. This collaborative ecosystem accelerate s innovation and supports the transition to high- volume manufacturing.
Platinum Sponsors:
2025
NHanced Semiconductor Inc.
NHanced Semiconductor Inc. is revolutionizing heterogeneous 3D hybrid integration (3DHI) by overcoming challenges associated with integrating diverse materials like GaN, SiC, and LiNbO3. Using techniques such as incremental annealing and material thinning, NHanced achieves high-density interconnects with hybrid copper and covalent oxide bonding. These innovations enable the production of advanced 3DHI devices with unprecedented performance and power efficiency. By facilitating the integration of exotic materials, NHanced unlocks new possibilities, including intelligent AI-enabled IR sensors, advancing applications previously unattainable with traditional approaches.
Technology Enablement Awards
ACM Research With the growing demand for AI applications requiring large chiplet GPUs and high-density HBM, the industry is shifting from traditional 300mm wafer packaging to larger substrates like 510x515mm or 600x600mm to reduce costs and improve efficiency. ACM Research's Ultra ECP ap-p system is the first commercial high- volume copper deposition tool designed for panel-level packaging, offering advanced solutions for processes like pillar, bump, and RDL plating. Its horizontal chamber configuration ensures excellent uniformity, minimizes
contamination, and supports up to 16 plating chambers. The system is operational in cleanrooms, with additional units set for deployment to customers.
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