In addition to customer partnerships, Bijjam also highlighted EV Group’s active internship program with ASU and the company’s relationship with several university professors. Finetech is another global company with a longstanding Arizona location. Opened in 1999, Finetech’s Mesa, Arizona location is home to its sales and support center for all equipment it sells in the U.S. The Mesa location also features a showcase room with all of the company’s equipment, so customers can run feasibility trials and access Finetech’s process development services. (Figure 7)
“University sales have really picked up in the past year, specifically due to funding from the CHIPS Act,” said Neil O’Brien, General Manager at Finetech Americas. O’Brien also highlighted increasing opportunities for Finetech to work with customers on process development and experimentation initiatives, specifically on projects that have received funding from the CHIPS Act. Key Takeaways Arizona is working to create a robust advanced packaging ecosystem, with all parties working effectively together to build the future of this industry. Local governments are incentivizing businesses to bring their advanced packaging capabilities to Arizona, and ASU is working to educate and train the next generation of packaging professionals in accordance with the needs of Arizona’s local companies. Although companies that had a pre-existing presence in Arizona aren’t benefiting from funding directly, the influx of new businesses in the state has led to increased tool sales, partnership opportunities, and access to a broader talent pool.
Figure 7: EV Group’s Vineeth Reddy Bijjam, Director of Technology and IP, hosted Jillian McNichol’s visit. Will Arizona be able to maintain its momentum and establish itself as a North American hub for packaging innovation? Only time will tell, but I’m optimistic for the future. 2024: A Year of Growth and Innovation By Peter Dijkstra 2024 was another year of significant growth for
Power delivery solutions enabling the next generation of AI processors and accelerators Powering AI with STILE™
but an interposer allows for additional integration. 3D IC packaging involves vertically stacking components, enabling higher levels of integration and potentially improved performance and power efficiency. These devices are increasingly interconnected using through- silicon vias, which are fabricated using the Bosch process. Our Trymax Process Module excels at efficiently cleaning residual polymer after the Bosch process. Additionally, to facilitate easier copper filling of the created vias, our Process Module is capable of creating a bowl etch on top of the vias. Before Chip-to-Wafer (C2W) or Wafer-to-Wafer (W2W) stacking, it is essential to clean and, where possible, activate surfaces. Our Trymax low-cost Process Module simplifies this cleaning process while simultaneously activating the surface to make it more hydrophilic. On behalf of the entire Trymax team, I would like to extend our heartfelt thanks to our customers and suppliers for the trust and confidence they have placed in us throughout this year.
Trymax Semiconductor Equipment B.V. This year was marked by several pivotal developments, including the successful ramp-up of our new manufacturing facility, the establishment of a dedicated quality department, the expansion of our team with additional Field Service Engineers, and the growing momentum of our USA team, which resulted in multiple purchase orders. In the broader market, while the automotive sector remains stable, particularly in silicon carbide (SiC) applications, other markets have experienced slower growth. However, we have observed a substantial increase in the storage and availability of data, with ambitious forecasts driven by the increasing demand for high-speed data access everywhere. The most substantial growth for Trymax this year came from advanced packaging applications. Our process team has been dedicated to developing various process applications related to 2D, 2.5D, and 3D packaging technologies. In 2D IC packaging, components are arranged on a single plane. In 2.5D IC packaging, components remain on the same plane,
The STILE™ offers a new paradigm for in- package power delivery that significantly improves efficiency and performance while freeing up package real estate to enable higher levels of chiplet integration. A multi-domain, substrate-embedded, passive module, STILE™ is designed to support the growing number of power rails within the package.
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