CONTENTS 4 ............... Contributing Authors 7 ............... Editorial: Interconnectology Saves the World! TECHNICAL FEATURES 9 ............... Cost-effective, High-performance Chips Are Driving the Move to Panel-level Processing By Jim Straus, ACM Research 10 ............... What You Need to Know about PFAS By Julia Freer, JLFG Communications 13 ............... Taking 3D IC Heterogeneous Integration Mainstream By Tony Mastroianni and Todd Burkholder, Siemens EDA SPECIAL COVER SECTION 16 ............... Hot Spots in Advanced Packaging Around the Globe with an Introduction by Françoise von Trapp 17 ............... How Arizona is Growing its Advanced Packaging Capabilities By Jillian McNichol 20 ............... 2024: A Year of Growth and Innovation By Peter Dijkstra, Trymax Semiconductors 23 ............... Empowering the Future: New York's Semiconductor Surge in 2024 By Scott Sikorski, Ph.D., IBM 24 ............... Advanced Packaging in Asia By Dean Freeman, Freeman Technology and Market Advisors 27 ............... US-JOINT Consortium: Strengthening Semiconductor Innovation Across Borders By Avery Gerber 29 ............... Navigating the European Chip Renaissance By Paul Lindner, EV Group 33 ............... The "White House of Microelectronics Packaging" Celebrates its 15th Anniversary! By Juliana Panchenko and Frank Windrich, Fraunhofer IZM-ASSID 34 ............... Witnessing Foundry 2.0 in Action By Françoise von Trapp 37 ............... Picking up the Pace of Panel-level Advanced Packaging at Onto Innovation
By Françoise von Trapp SPECIAL SECTION
40
............... 2025 3D InCites Awards Finalists Summarized by Avery Gerber 40 ............... Technology Enablement Awards
43 ............... Engineer of the Year 44 .............. Best Place To Work
3D InCites Yearbook
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