CONTENTS 4 . .............. Contributing Authors 7 . .............. Editorial: This. Is. Community. ON THE COVER 22 . .............. Leading the Charge to One Trillion Dollars: A Conversation About Leadership with SEMI CEO Ajit Manocha By Françoise von Trapp, 3D InCites 9 . .............. Is Our Industry Moving Fast Enough on Sustainability? By Julia Goldstein, JLFG Communications 11 . .............. The Role of 200mm Manufacturing in Enabling a One Trillion Semiconductor Industry By Abdul Lateef, CEO, Plasma-Therm 13 . .............. The Semiconductor Cycle: Looking into the Future By Dean Freeman, 3D InCites 17 . .............. Solving the AI Puzzle By Monita Pau, Onto Innovation 20 . .............. Driving into the Future: The Next Phase in Automotive Compute Package Adoption By Prasad Dhond, Amkor Technology, Inc. 26 . .............. Five Workflows for Tackling Heterogeneous Integration of Chiplets for 2.5D/3D Kevin Rinebold, Siemens EDA SPECIAL SECTION 28 33 . .............. Adele Hars Award for DEI 35 . ............. Best Place To Work Award 36 . .............. EV Group: More than 40 Years of Growth Fueled by 3D/Heterogeneous Integration By Paul Lindner, EV Group 39 . .............. The Year in Test By Mark Berry, Test Strategies Consultant 40 . .............. Thermal Simulation of a Packaged GaN MMIC By Casey Krawiec and Erik Sanchez, StratEdge Corporation 42 . .............. Balancing Precision and Throughput in 3D Structures with Advanced Packaging and Motion Control By David Doyle, HEIDENHAIN 44 . .............. When Plasma Matters: Three Reasons to Choose Plasma By Peter Dijkstra, Trymax Semiconductor 46 . .............. Bridging the Path from University to Industry By Rene Dubois, ClassOne Technology . .............. 2024 3D InCites Awards Finalists 28 . .............. Technology Enablement Awards 32 . ............. Sustainability Award
3D InCites Yearbook
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